connecting technology
services overview
Flexible Printed Circuits Design & Source Control Services
Miraco's mission is to provide comprehensive engineering and global sourcing services specializing in flexible interconnect systems. Miraco provides design engineering, documentation, procurement, supply chain management and specialized added value services. We focus on meeting the program goals of environmental, electrical, mechanical and cost objectives while providing a balanced solution.
Miraco's engineering design team, specialized added value services, quality control lab and test equipment located in Manchester, NH combined with FPC manufacturers, both foreign and domestic, provides our customers with the complete solution that anticipates the issues encountered during the product life cycle:
- In-house Engineering Design Team
- In-house Quality Control Lab
- Domestic partners who specialize in quick turn prototypes, production volumes and ITAR requirements
- Offshore partners where Miraco can transparently move the manufacturing to a low cost region while still maintaining quality controls
Design & Sourcing Capabilities
Together, We Can Connect the Inner Systems
ENGINEERING:
- 200 plus combined years of design and manufacturing experience with all FPC and other interconnect solutions
- Knowledge derived from 30+ patents in the field of flex interconnects and connector technology
- Complete engineering support takes the customer from design and testing to manufacturing
- Full documentation on Miraco’s or customer’s format
SOURCE CONTROL MANAGEMENT:
- Miraco leverages its combined flex circuit purchases to achieve the best lead time and lowest material cost to benefit all our customers
- Miraco creates, controls and provides complete “READY FOR MANUFACTURING” documentation and data packages
- Miraco can seamlessly dual source applications to assure program delivery requirements
- Miraco exceeds conventional quality control practices to insure all parts are built to print
- Miraco has the systems and procedures in place to accommodate your preferred scheduling requirements such as: Kanban, JIT, Ship-to-Stock
- Assembly services provided by Miraco using approved and qualified contract manufacturers
MANUFACTURING SERVICES:
- Laser Services and Plasma Cleaning
- Steel Rule Die Outlining
- Class A Die Outlining
- Folding, Wrapping, Forming
- Overmolding Silver Shielding (360 Degree Coverage)
- Marking and Labeling
- Solder Assembly
- Electrical Testing
MIRACO ADVANTAGE:
- Independent, unbiased design
- Internally used process, competent technical understanding
- Total Solution provider
- Improve reliability while enhancing performance
- Improved overall system value
- Ideal for low temperature applications
- Safe for delicate electronic applications
- RoHS Compliant
- Machines in Miraco North and Miraco South
Design Formats
Autocad (DXF, DWG), Gerber (RS274-X) Solid Works (IGES, SLDPRT)
Panel Size
24" Maximum Width, 10' + Length
Covercoat Thickness
0.0005" and up
Layer Count
1-18
Interconnect Assembly Types
Thru-hole and SMT
SMT, BGA, Hybrid FFC/FPC
Finished Hole Size
Compliant Pinned (rigid zone only) Via (A/R dependent)
0.018" (0.457mm)
0.008" (0.203mm)
0.008" (0.203mm)
Internal Features (Copper Weight Dependent)
Trace
Spacing
Spacing
0.003" (0.0762mm)
0.003" (0.0762mm)
0.003" (0.0762mm)
Materials
Polymide - Standard Acrylic / Epoxy
Polymide - FR Acrylic / Epoxy
Polymide - Adhesiveless
Polymide - FR Acrylic / Epoxy
Polymide - Adhesiveless
Silver Epoxy Shielding
Soldermask
FR-4/21 & 24
Soldermask
FR-4/21 & 24
Copper Processing
1/4 oz. (0.00035") and up
Impedance Single & Differential
+/- 10%
Surface Finishes
HASL
OSP- Entek 106
ENIG
OSP- Entek 106
ENIG
Immersion Tin
Immersion Silver
Bright Tin
Ni/Au
Immersion Silver
Bright Tin
Ni/Au
Assembly Capabilities
Full Turn-Key
Thru-hole- Wave & Manual
SMT - Pick & Place
Wire-bond
Crimp
RoHS Compliance
Thru-hole- Wave & Manual
SMT - Pick & Place
Wire-bond
Crimp
RoHS Compliance
Custom Connection (interconnection forming)
Test Capabilities
Impedance Testing
Hi-Pot up to 5,000 VDC
2,000+ points per circuit
Insulation Resistance up to 500 VDC
Four Wire Kelvin .001 & up
IPC-TM-650 (Env-Mech Testing)
X-Ray Composition Analysis
Plating Thickness
Hi-Pot up to 5,000 VDC
2,000+ points per circuit
Insulation Resistance up to 500 VDC
Four Wire Kelvin .001 & up
IPC-TM-650 (Env-Mech Testing)
X-Ray Composition Analysis
Plating Thickness
Bed of Nails
Flying Probe
Flex Cycling
Environmental
Functional Test
LED's, Diodes, Resistance Capacitors
Flying Probe
Flex Cycling
Environmental
Functional Test
LED's, Diodes, Resistance Capacitors
Mfg. Standards
IPC-6013 Class I, II and III; Types 1-5
MIL-P50884 / 31032 Types 1-5
AS9100 Certification
MIL-P50884 / 31032 Types 1-5
AS9100 Certification
IPC-610
UL94V-0
ISO 9001:2015 to 2018
UL94V-0
ISO 9001:2015 to 2018
Laser Capabilities
Outline +/- 0.003"
Exposure single & double sided
Exposure single & double sided